SMT Equipment & Tools
Electronic Chemical Materials
 
8610 Non-Silicone Heat Transfer Compound

- Off white
- Thermal Conductivity:0.773 w/m‧k
- Use for CPU、Chipset、GPU、
  IC、NB、VGA、LED

 
  • Overview
  •     
  • Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
  • High efficient thermal conductive properties
    -Means more rapid transfer of heat for longer component life
  • High temperature stability
    -Provides physical properties of low bleed and low evaporation for long-term service in any application that requires Heat Sink Compound.
  • Uses synthetic fluids and metal oxide fillers
  • Provides excellent conductive properties that exceed those of other heat sink formulas
  • Will not dry, harden, melt or migrate in any heat sink application
  • Compatible with metal and plastic components 

 

Benefits of Non Silicone Heat Transfer Compound OVER Silicone
No migration and component contamination.

  

 Available Size:

Model

Available Size

Description

8610-60G

60 gram (2 oz)

tube

8610-1P

473 ml (1 pint)

tub