All parameter can be directly settled on the LCD panel without using any other facility. Besides, it is equipped with extra removable controller for easy operation.

All soldering parameter can be saved and installed with USB Disk.

Clear Temperature Parameter List

Fast check on 99 sets of profile memories : completely solves the profile reset problem caused by the difference of BGA chips. Save operation time and enhance production efficiency.

Unlimited sets of profiles space: Besides fast check function, Operators can install as many as every temperature profile on BGA-936USB via built-in USB Disk Port. "Once used, forever memorized." is our constant promise to clients.

Excellent Temperature Profile Setting

World No.1 Model created Different Color Alignment System (Patent No : 177479)

Special design for CSP (µBGA. Tiny BGA), fine pitch BGA and LLP.

When images of BGA and PC Board overlap, comparison between two images will be very clear.

Automatic Z spindle and Alignment system: Quick and smooth movement, accurate location with aviation industrial precision linear motion guide.

Bright Color Comparison
Simply overlap the red of solder balls and green of pad into one image.

Auto / manual option for Z spindle. Fully enhance soldering efficiency and easy operation.

BGA Alignment procedure and soldering work are proceeded at the same position.

No need to do alignment on the right and reflow on the left side. Completely avoid aligned BGA chips deviation due to movement.

The Best Coaxial Mechanism
Pick up, alignment and reflow at the same position avoid chips moving.

Completely avoid the position difference caused by manual operation.

Fast, safe, efficient solution. No more solder paste trouble resulted from direct contact with hand.

Best precision even long term continuous usage. No need to adjust X, Y shafts at all.

Best Position by BGA chip Location device (Option)

Rapid desoldering and soldering, increase 50% efficiency.

Preheating area : 360 x 260 mm is able to divided into 3 zones to satisfy the need for different-size PCB.

Preheating zones can be operated synchronously or independently. Completely solve warpage / twist problem caused by uneven / tiny preheating.

Module design : low cost for maintenance and repair.

Ultra Larger Preheating Zone
Shorten preheating time and offers sufficient and even preheating to all PCB.

Drastically reduce cooling time by 50% than other designs.

Work with electricity and no extra air compressor needed.

Built-in auto cooling system highly increase 50% working efficiency.

Auto Quick Cooling Device System
Increase 50% efficiency.

Soldering Head and CCD camera: directly controlled by Microprocessor or soldering head control box aside.

User-friendly design: no more damage due to wrong operation in CCD camera system. Alignment system will automatically turn off while soldering head going down. 

Super Fine Automatic Mechanism

Durable structure design: Even put 50 kg heavy stuff on either side of PCB clamper, no shake will happen. 

Advanced linear motion guide: Not only make working table movement more smoothly but make whole structure more durable.

Durable PCB Clamper Table

Completely solve lead-free rework process strict requirement.

High efficiency Nitrogen reflow system for option.

If any question about Lead-Free Soldering, contact Fonton right now!.